by Bill McDermid The value of membership in IEEE and its societies may be questioned by some when their employer subscribes to IEEE publications. There are many benefits to membership in IEEE that mostly relate to the advancement of your career. Member benefits include IEEE Spectrum magazine, The Institute newspaper, IEEE-tv, IEEE E-mail Alias with virus and spam protection, IEEE Job Site, and discounts on products and publications. A number of financial and personal benefits are available to IEEE members. For more information, visit http://www.ieee.org/benefits. Most IEEE conferences, including those fully sponsored by DEIS, provide a substantial reduction in registration fees for IEEE members. The saving when attending only one fully sponsored conference will typically offset the annual IEEE membership fee. Participation in IEEE conferences provides an excellent opportunity to network with your peers in other organizations. As an added benefit, your paper will appear not only in the proceedings of the conference but will also be available through IEEE Xplore for years to come. Reduced fees for IEEE members are also provided at the events sponsored by most local Sections and Chapters. Several of the fully sponsored DEIS conferences host the meetings of working
July/August 2008 — Vol. 24, No.4
groups that are developing or revising IEEE standards. Working group members who are members of IEEE and IEEE-SA are able to vote when these documents are submitted for ballot. DEIS membership at $20 per year ($10 for student members) provides access to the online version of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) through IEEE Xplore. In 2007 TDEI published 1566 pages, including three special issues on vacuum insulation, power modulators/repetitive pulsed power, and ice or snow covered insulators. The same $20 fee also provides you with six issues of the IEEE Electrical Insulation Magazine. Non-member fees for both of these publications are substantially higher. DEIS student members can apply for DEIS Graduate Fellowships that are currently $5,000. For those persons who wish to be DEIS members without being a full member of IEEE there is currently the option of being an IEEE Affiliate at a reduced annual fee. *************** AdCom has approved a further change in the DEIS Bylaws. This affects Bylaw 5.1 and Bylaw 5.2. The change was made to avoid any perception of conflict-ofinterest. These revisions are published elsewhere in this issue. There have been some changes in committee chairs. Simon Rowland of the University of Manchester has replaced Len Dissado of the University of Leicester as Chair of the Multifactor Stress Committee. Gian Carlo Montanari of TechImp is replacing John Densley of ArborLec Solutions as Chair of the Symposium Advisory Board of ISEI. DEIS maintains a collection of 53 videotapes that were produced over the years at the Electrical Insulation Conference
(EIC). The availability of these videotapes is advertised about twice a year in this Magazine. For many years Raji Sundararajan, who is now at Purdue University, has managed the loan of individual videotapes. She is turning this task over to Liang Tang of EPRI in Charlotte, NC. Inquiries can now be directed to Dr. Tang at [email protected] com It is planned to convert the videotapes to DVD format. I thank Prof. Sundararajan for her many years of dedicated service to DEIS in managing this important resource. I would be remiss if I did not also acknowledge the work of John Tanaka at the University of Connecticut and Sudhakar Cherukupalli at BC Hydro in the production of the videotapes during EIC. In May I attended a portion of the International Power Modulator Conference comprising the 28th Power Modulator Symposium and 2008 High Voltage Workshop in Las Vegas, NV. This is the second IPMC that has been fully sponsored by DEIS. The Electron Devices Society and the Nuclear and Plasma Sciences Society are technical co-sponsors. This year there were 352 persons registered, which was an increase of 103 over attendance in 2006. I counted 18 well-attended exhibits. Harry Orton, Meetings Chair of DEIS, reports that the organization of our fully sponsored 2009 conferences is well advanced. This includes EIC in Montréal, Canada, 1–3 June 2009 (http://ewh.ieee. org/conf/eic), and ICPADM in Harbin, China, 19–23 July 2009 (http://www. icpadm2009.com). With the concurrence of AdCom, I have signed on behalf of DEIS a Memorandum of Agreement for technical co-sponsorship of ICHVE in Chongqing, China, 9-12 November 2008 (http://www.ichve2008.cqu.edu.cn) For news about other DEIS fully sponsored and technically co-sponsored conferences please visit http://www.deis. nrc.ca.